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ODM OEM FR4 TG170 5G Optical Module PCB 8 Layer Optical Transceiver PCB

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ODM OEM FR4 TG170 5G Optical Module PCB 8 Layer Optical Transceiver PCB

Name: ODM OEM FR4 TG170 5G Optical Module PCB 8 Layer Optical Transceiver PCB
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : FR4 TG170

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : ENIG

Payment Terms : Western Union

Supply Ability : 1 Million Square feet/per month

Certification : UL ,IOS9000

Board Thickness : 0.8 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 8-Layer

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ODM OEM Custom 8L 5G Optical Module PCB Optical Transceiver PCB

The ODM OEM Custom 8-Layer 5G Optical Module PCB is specifically engineered for high-speed optical transceivers, data center networking equipment, 5G communication infrastructure, and optical transmission systems. Featuring an advanced 8-layer PCB structure, this board delivers exceptional signal integrity, controlled impedance performance, and superior reliability for high-frequency and high-bandwidth applications.

Key Specifications

Layer Count	8-Layer
Material	FR-4 TG170
Board Thickness	0.8 mm (Customizable)
Copper Thickness	1/0.5/0.5/0.5/0.5/0.5/0.5/1 oz
Minimum Hole Size	0.1 mm
Minimum Line Width	0.075 mm
Minimum Line Spacing	0.075 mm
Solder Mask Color	Green
Surface Finish	ENIG

Product Description

Optimized for 5G Optical Modules
- Designed for high-speed optical transceivers and optical communication equipment.
- Supports data rates required for next-generation 5G and data center applications.
Advanced 8-Layer PCB Structure
- Provides dedicated signal, power, and ground layers for enhanced performance.
- Improves signal routing efficiency and power integrity.
Excellent Signal Integrity
- Controlled impedance routing minimizes signal loss and reflection.
- Supports high-speed differential pair transmission and low-latency communication.
Low-Loss Material Compatibility
- Available with high-frequency and low-Dk materials for superior electrical performance.
- Reduces insertion loss in high-speed optical networking applications.

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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